Fully depleted, trench-pinned photo gate for CMOS image sensor applications - Institut des nanotechnologies de Lyon Accéder directement au contenu
Article Dans Une Revue Sensors Année : 2020

Fully depleted, trench-pinned photo gate for CMOS image sensor applications

Résumé

Tackling issues of implantation-caused defects and contamination, this paper presents a new complementary metal–oxide–semiconductor (CMOS) image sensor (CIS) pixel design concept based on a native epitaxial layer for photon detection, charge storage, and charge transfer to the sensing node. To prove this concept, a backside illumination (BSI), p-type, 2-µm-pitch pixel was designed. It integrates a vertical pinned photo gate (PPG), a buried vertical transfer gate (TG), sidewall capacitive deep trench isolation (CDTI), and backside oxide–nitride–oxide (ONO) stack. The designed pixel was fabricated with variations of key parameters for optimization. Testing results showed the following achievements: 13,000 h+ full-well capacity with no lag for charge transfer, 80% quantum efficiency (QE) at 550-nm wavelength, 5 h+/s dark current at 60◦C, 2 h+ temporal noise floor, and 75 dB dynamic range. In comparison with conventional pixel design, the proposed concept could improve CIS performance.
Fichier principal
Vignette du fichier
roy1.pdf (2.69 Mo) Télécharger le fichier
Origine : Fichiers éditeurs autorisés sur une archive ouverte

Dates et versions

hal-03770921 , version 1 (15-09-2022)

Licence

Paternité

Identifiants

Citer

François Roy, Andrej Suler, Thomas Dalleau, Romain Duru, Daniel Benoit, et al.. Fully depleted, trench-pinned photo gate for CMOS image sensor applications. Sensors, 2020, 20 (3), pp.727. ⟨10.3390/s20030727⟩. ⟨hal-03770921⟩
127 Consultations
75 Téléchargements

Altmetric

Partager

Gmail Facebook X LinkedIn More